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While there have been some improvements in production yield and stability since the Lunar New Year, overall shipment figures have not met expectationsDespite this, the market's adaptability has proven impressive, significantly mitigating risks associated with the slow GB200 shipments anticipated in the first half of 2025. Consequently, some analysts have recalibrated their forecasts, reducing their previous optimistic outlook for GB shipments in 2025 from a range of 35,000 to 50,000 units down to a more conservative estimate of 20,000 to 25,000 unitsThis adjustment reflects a pragmatic understanding of GB200's current status and provides a more realistic basis for future market decisions.
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This rapid technological advancement underscores NVIDIA's commitment to continuous innovation and breakthroughs in the AI chipset sectorThe report also notes a relatively smooth progression for the downstream rollout of the B300 and GB300, with no significant changes observedLarge-scale production of B300 OAM (or SXM) modules is expected to commence in Q2 2025, while the launch of the B300 HGX is projected for mid-2025, and small-scale availability of the standard GB300 system may occur in Q3 2025. However, the rollout of GB300 faces its own set of challengesThe bill of materials design for the B300 UBB and GB300 compute boards remains unresolved, as NVIDIA seeks to reduce costs and diversify its supplier base by introducing a substantial number of new component vendorsWhile this influx of new suppliers may enhance cost efficiency and stabilizes supply chains, it complicates the coordination and finalization of the bill of materials, requiring additional time and resources.
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